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Implementation
Strategies for USB Circuit Protection Technology
Adrian
Mikolajczak
Understanding
the USB specification is key to selecting the proper circuit protection
devices.
The
USB specification requires current limiting and power switching
for USB power management. The specification references resettable
polymeric positive- temperature-coefficient (PPTC) devices and solid-state
switches as acceptable methods of overcurrent protection. Like fuses,
PPTC devices help protect circuitry from overcurrent damage.
Unlike
fuses, however, PPTC devices reset when the circuit is de-energized
and the fault is removed. In addition to their resettability,
the critical design advantages of these devices in USB applications
are low resistance, fast time-to-trip, low tripped power dissipation,
and inherent resistance to nuisance tripping. They also help provide
a lower-cost solution than silicon equivalents.
Protected
power-switch devices integrate current-limiting functionality
with power switching. These devices are most commonly used in
bus-powered hubs, dual-mode hubs, and low-power hosts. They can
also function as inrush-current-limiting devices. They combine
low resistance with extremely fast current-limiting capability.
Such devices are a practical, cost-effective solution for power-constrained
hosts, where a fast current-limiting response further reduces
system voltage droop in a fault condition and where power switching
can be used to improve energy conservation.
Industry
Specification Requirements
The
USB specification states that current limiting, power switching,
or both may be required in a USB product, as shown in Table I.
Where current limiting is required, the UL 60950 specifications
must be met. This means that in the event of a short circuit or
other fault condition, current output must be limited to below
5 A within 60 seconds. The USB specification also defines acceptable
voltage output levels and limits total voltage drop in the system.
PPTC Device Technology
PPTC
circuit-protection devices are made from a composite of semicrystalline
polymer and conductive particles. At normal temperatures, the
conductive particles form low-resistance networks in the polymer
(see Figure 1). However,
if the temperature rises above the device's switching temperature
(TSw), either from high current through the part or
from an increase in the ambient temperature, the crystallites
in the polymer melt and become amorphous. The increase in volume
during melting of the crystalline phase causes a hydraulic separation
of the conductive particles and results in a large nonlinear increase
in the resistance of the device.
The
resistance can increase by three or more decades. This increased
resistance protects the equipment in the circuit by reducing the
amount of current that can flow under the fault condition to a
low, steady-state level. When the device transitions to the high-resistance
state, it is said to have "tripped." The device will remain in
its tripped (high-resistance) position until the fault is cleared
and power to the circuit is removedat which time the conductive
composite cools and recrystallizes, restoring the PPTC to a low-resistance
state in the circuit and returning the affected equipment to normal
operating conditions.
PPTC
devices are typically used in USB hosts and in USB self-powered
hubs. The resettable current-limiting devices are placed in series
with the output power port of a USB device. Current limiting in
a fault condition helps prevent circuit damage and systemwide
voltage droops. With individual port protection, it allows the
remainder of the USB bus to continue functioning even if one port
is short-circuited. As shown in Figure
2, the critical device parameters in USB applications include
time-to-trip, resistance, and power dissipation.
PPTC
devices are resistive series elements on the USB power bus. Resistance,
unless otherwise stated, applies to a device when it is not in
the tripped state. As such, the lower the PPTC device resistance,
the lower the voltage drop between the power supply and the USB
output pin during normal device operation. In bus-powered hub
applications, voltage drop must be less than 0.1 V, which means
that total resistance, including all series elements and the board
traces, must be less than 1 W (at 100
mA). In hosts and self-powered hubs, no voltage drop is specified;
it is dictated instead by the requirement that the output voltage
be 4.75 V minimum.
Hold
current is the highest steady-state current that a device will
maintain for an indefinite period without tripping. Hold current
is temperature dependent, and the designer must consider the maximum
ambient temperature that the device will be exposed to. Generally
speaking, lower hold currents imply higher resistance and faster
trip time, and higher hold currents offer lower resistance. For
low-power applications, a device with the lowest possible hold
current should be selected.
Time-to-trip
characterizes the speed at which a PPTC device will trip in a
fault condition. Time-to-trip is critical in low-power applications
because a small power supply may only be able to source short-circuit
currents for short periods before the overall system voltage is
reduced (or droops) and system operation is affected. Time-to-trip
values are highly dependent on device design, device size, and
hold current. These values can also be influenced by board layout,
where large trace sizes or pads functioning as heat sinks will
increase time-to-trip. Reducing pad sizes and selecting a device
with a low hold current can improve time-to-trip results.
| USB
Device |
Overcurrent
Protection1 |
Power
Switching1 |
| Host
controller |
Required |
Optional |
| Self-powered
hub |
Required |
Optional |
| Bus-powered
hub |
Optional |
Required |
| Dual-mode
hub2 |
Required |
Required |
|
1.
May be designed on either a ganged or individual-port
basis.
2. Dual-mode hubs can function as both powered or
bus-powered hubs.
|
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| Table
I. Circuit protection and power-switching requirements for
USB. |
Tripped
power dissipation, or leakage current, is another important consideration
for low-power designs. After a PPTC device is tripped, it will
stay latched in a high-resistance state, continuing to pass a
small trickle current (dissipate power) until it exits the tripped
state. The lower this trickle current, the lower the power drain
on the system during a fault condition.
Protected
Power-Switch Technology
Protected
power-switch devices are silicon series elements used in the USB
power bus to control the flow of power to ports and to help protect
circuitry and devices from overcurrent conditions. Like the PPTC
device, the protected power switch trips in an overcurrent condition,
but it does so in a two-phased approach. The device trips in microseconds,
limiting current to a predefined range that is higher than nominal
operating current. It then flags the controller that a fault condition
has occurred. The controller can then shut down the port by toggling
the enable pin on the power switch. If the controller does not
respond, the power switch cycles the port on and off to prevent
internal thermal damage.
The
critical device parameters in USB applications include switch
resistance, continuous output current, time-to-trip, current-limit
set point, fault-flag delay, current-limit release point, and
tripped current draw.
Switch
resistance can affect both system power draw and the end-user
experience. This resistance is measured through the device when
it is not in current-limiting mode. High switch resistance can
result in excessive voltage drop through the device, which can
result in USB noncompliance and the device functioning improperly.
Silicon switch resistance can be a function of supply voltage,
and the best device will minimize resistance and voltage drop
at lower bus voltages in order to maintain USB output voltage
compliance.
Continuous
output current is the current level at which the device will not
trip. For low-power applications, this current should be set as
low as possible while still supporting the USB specification.
Time-to-trip
defines the speed at which a protected power- switch device activates
its current-limiting circuitry. The extremely fast time-to-trip
of the silicon device makes it the preferred choice for power-constrained
applications. Unlike the PPTC device, however, posttrip current
levels can remain fairly high and are defined by the current-limit
set point. The current-limit set point is the level at which a
silicon device will limit current once it has tripped. Its value
varies depending on the severity of the fault condition. The value
is typically defined as a function of the fault condition's resistance.
For low-power applications, the current limit should be specified
as low as possible.
Integrating
a fault-flag delay with the silicon device helps prevent nuisance
tripping and improves the end-user experience. The fault flag
is a logic-level output that alerts the USB controller when there
is a problem with a specific USB port. During USB hot-plug events,
many USB functions are highly capacitive and can draw significant
current, exceeding specification limits. This increased draw of
current causes the device to trigger a short-lived current-limiting
condition that, if signaled to the controller, will cause nuisance
tripping. As shown in Figure
3, a 9-millisecond fault-flag delay prevents these short-lived
events from triggering the fault flag.
The
current-limiting release point is a critical parameter for the
end-user experience. This is the current level at which the silicon
device will disengage its current-limiting function. This is an
important design consideration because once current limiting is
active, device resistance dramatically increases and may prevent
proper functioning of an attached USB device. If set too low,
a device that enters current-limiting mode during hot-plug may
remain tripped when initial in-rush currents subside, preventing
proper operation of USB functions. By setting current-limiting
release points above 500 mA, the protected power switch will cease
to limit current once the USB device returns to normal operating-current
levels.
Initial
power dissipated at the port after a trip event is a function
of the silicon device's limit current. If the device can be turned
off during a fault condition, port current draw and power draw
are negligible. If, however, control circuitry is not implemented
(i.e., the enable pin is tied high in a high-enable device or
power switching is not integrated into the device), most silicon
devices will continue to limit current until they reach an internal
temperature threshold. When the temperature threshold is reached,
they will begin to thermally cycle the port on and off. Average
port current draw under these conditions will be a function of
the thermal duty cycle and the current limit. For low-power applications
using silicon devices, it is important to implement proper on-off
control circuitry to prevent high tripped power dissipation.
Improve
Reliability, Reduce Component Count
Protected
power switches can integrate numerous detection and protection
functions, resulting in improved performance and reduced component
count. Figure 4 compares
a typical silicon power switch to a protected power switch.
In
a typical power-switch implementation, Cfilter and
Rfilter are used to generate a delay in the fault-flag
signal, whereas Raychem protected power switches integrate this
feature and obviate the need for off-board circuitry. The fault-flag
delay prevents inrush currents from causing the port to nuisance
trip, and the attached device is able to begin normal operation.
To further minimize external component count, the protected power
switches integrate pull-up and pull-down resistors for the Enable
and Flag pins (OC1 and OC2).
These
protected power switches are designed so that the fault-flag outputs
are set at complementary metal oxide semiconductor (CMOS) levels.
This is critical for low-cost implementations, as some controllers
cannot support 5-V inputs. By supporting a CMOS-level output, no
external voltage-splitting network is required.
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| Figure
5. Independent overcurrent and overtemperature coordination.
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The
protected power switch also facilitates independent port protection
to improve end-user experience. When a legitimate overcurrent
condition is detected and the offending port is turned off, the
remaining ports are unaffected. Figure 5 demonstrates independent
port protection where a 1-W load is
connected to Channel A to simulate a 5-A overcurrent condition,
while a 185-mA continuous load is applied to Channel B to simulate
normal device operation.
The
power switch device detects the fault on Channel A and begins
to limit current. On Channel A only, the protected power-switch
device will eventually begin to cycle on and off until the fault
is resolved. However, operation on channel B continues unaffected
because its continuous load current is within specification.
This independent port-protection functionality also affects power
consumption and allows limit points to be minimized to reduce
the power drain in a fault condition. Because each port is protected
individually, maximum expected currents are 500 mA and below,
as opposed to ganged protection, where a single channel protects
two ports at 1 A continuous current.
The
ability to enable or disable a port is important in low-power
applications. In a fault condition, a silicon device enters current-limit
mode, preventing extreme current spikes and voltage droops, but
it will continue to allow significant current to pass through
the port. If the port cannot be disabled, the silicon device will
eventually enter a thermal cycle mode. Cycling will reduce total
power draw, but this draw can still be in excess of 1 W per channel.
As shown in Figure 5, with the protected power switch, Channel
A could be shut down by the controller, resulting in a port current
draw on the order of 10 µA.
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| Figure
6. With the protected power-switch device, resistance decreases
as input voltage decreases. |
Another
important consideration in USB designs is resistance drop with
decreasing voltage. As the supply voltage decreases, voltage drop
becomes increasingly critical. Typically, as voltage decreases,
power switches increase in resistancean undesirable characteristic.
As depicted in Figure 6, the protected power-switch device resistance
decreases as the supply voltage decreases. When bus voltage is
high, this reduces output current to improve power efficiency
and battery life. When the bus voltage is low, the voltage drop
across the power switch is reduced, allowing the USB function
to continue to operate for a longer period.
Conclusion
Resettable current limiting in a fault condition helps prevent
circuit damage, systemwide voltage droops, and associated system
failure. It also helps the system meet UL safety standards. Because
PPTC devices are typically a low-cost current-limiting solution,
they are frequently used in desktop hosts, laptops, and self-powered
hubs. Individual port protection with PPTC devices can also enhance
energy conservation and systemwide reliability.
Protected
power-switch devices are most commonly used in bus-powered hubs,
in dual-mode hubs, and in low-power hosts. They can also be used
in USB functions as inrush-current-limiting devices. Protected
power-switch devices integrate current-limiting functionality
with power switching, and provide low resistance and extremely
fast current-limiting features. These characteristics make them
suitable for power-constrained hosts, where the addition of power
switching can be used to achieve maximum energy conservation by
shutting down a port that has experienced a fault.
Adrian
Mikolajczak is multimedia market manager for Tyco Electronics
Power Components, Raychem Circuit Protection Div. (Menlo Park,
CA). He can be reached via e-mail at adrianm@tycoelectronics.com.
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