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Analyzing ESD Transient Suppressors in Printed Circuits
Roberto De Leo, Franco Moglie, and Valter Mariani Primiani
Analyzing printed circuits in the presence or absence of a transient
is useful for choosing the safest configuration for investigating changes
in electric behavior.
Nonlinear passive devices connected to circuit ports protect high-speed
data lines from damage caused by electrostatic discharge (ESD) transients.
This article addresses the design and performance characteristics of
a printed circuit with transient voltage suppression (TVS). Commercial
computer-aided design (CAD) was used to simulate the behavior of the
circuit in the presence of ESD to evaluate the level of protection provided
by the TVS.1 CAD also simulates the
circuit response with or without TVS. Analyzing the circuit response
is very important for high-speed-data printed circuits. This analysis
enables designers to evaluate the performance of TVS for each port,
especially ESD-protected ports and those subject to an induced voltage.
The analyzed circuits with TVS (varistor and avalanche diode), the
parasitic elements (cable and the connections), and the discharge generator
circuit were inserted into the CAD program using a macromodel. The two-layer
printed circuit board (PCB) consisted of three parallel microstrips
for each layer. ESD was applied to the central strip of the top layer.
The experimental results matched the simulations for each TVS analyzed.
Figure 1 shows the analyzed structure: two bundles of parallel lines
in two different layers cross over the same ground plane. ESD was applied
on one of the two central lines, and a suppressor was mounted at the
end of the line. The other lines were terminated by arbitrary loads.
Figure 2 shows two sections of the PCB: one parallel to the plane xz
and one parallel to the plane yz.
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| Figure 1. Geometry of the analyzed structure. |
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| Figure 2. Orthogonal sections (xz and yz) of the printed circuit.
Dimensions are: Wd = 1.76 mm, Wu = 2.64 mm, h1
= 1 mm, h2 = 1.6 mm,
t = 35 µm, εr = 4.9. |
The CAD package treats the bundle of parallel lines as a macromodel,
but it neglects the crosstalk between the crossing lines. To account
for this, a lumped crosstalk capacitance was inserted to correspond
with each numerically determined cross point.2
Figure 3 shows the complete configuration in the CAD simulation, including
loads, suppressors, and the ESD generator.
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| Figure 3. Configuration of printed circuit, connections, loads,
suppressors, and ESD generators. |
Figure 4 reports the ESD current waveform standardized by EN 61000-4-2.3
The waveform is characterized by a subnanosecond rise time
and a value of the current of few amperes; the same figure shows the
resistance-capacitance network specified by the standard as the equivalent
circuit of the generator. It is evident that the circuit of Figure 4b,
which would produce a zero rise time, cannot generate the waveform of
Figure 4a. The actual ESD gun exhibits a series inductance (due to the
return current ground cable), which is responsible for the finite rise
time in the current waveform.
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| Figure 4. An ESD current waveform (a) and standardized ESD
generator circuit (b) (R = 330 W, C = 150 pF). |
Unfortunately, the commercial simulator also exhibits stray elements,
which means that the actual waveform can be differenteven though
inside specificationsfrom the standardized one. For example, Figure
5 shows the voltage waveform produced by the laboratory ESD generator
when a 6-kV discharge was applied to a 50-W
coaxial cable.
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| Figure 5. Voltage pulse produced by a real ESD gun loaded by
a matched 50-W coaxial cable. |
To correctly reproduce the actual waveform, the network shown in Figure
6a was synthesized.4 The network, therefore,
had to be added to the CAD as a macromodel. Figure 6b shows the pulse
produced by the synthesized network. The circuit in Figure 6a can reproduce
the initial part of the experimental waveform correctly, which is important
for coupling because it is characterized by a high time derivative.
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| Figure 6. (a) Network for the simulation of the waveform of
Figure 5 (C1 = 150 pF, R1
= 330 W, L1
= 90 nH, C2 = 2.5 pF, L2
= 60 nH). (b) Voltage waveform of the ESD applied to a coaxial cable
(gun simulated by the circuit of [a]). |
Suppressor Characterization
Figure 7 shows a schematic of the suppressed circuit mounted to protect
a signal line. Ls represents the inductance of the connecting
traces. The suppressor device can be modeled by the circuit shown in
Figure 8. The suppressor is characterized by a series inductance Ls,
a series resistance Rs, and a capacitance Cp parallel
with a resistance Rp that is a nonlinear function of the applied
voltage.
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| Figure 7. Circuit of a suppressor mounted on the lines to protect
a signal line. |
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| Figure 8. Circuit model of the transient voltage suppressor. |
Two different situations must be analyzed: the component behavior in
the presence of ESD excitation (i.e. its ability to clamp the applied
transient) and the component's load on the line when the wanted transmitted
signal flows. The CAD package approached the first, considering the
macromodel for each device. Figure 9 illustrates the macromodel used
for the varistor.
In Figure 9, Lwires is the
inductance of the wires, Rbulk
is the substrate resistance, and Rleak
is the low-current resistance (for currents lower than 100 µA,
typically), whereas Rideal is
the nonlinear resistance that accounts for the high current flowing.
Finally, C is the capacitance at the clamping voltage. The values are
assigned using both actual measurements and information taken from the
manufacturer's data sheet. A more efficient suppressor for ESD excitation
is an avalanche diode. Figure 10 shows the macromodel used for this
component.
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| Figure 9. Macromodel for the varistor. |
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| Figure 10. Macromodel for the avalanche diode. |
In that figure, Rf
and Dfw signify
the component behavior up to the breakdown region. Dfw
incorporates the junction capacitance that assumes the value at the
breakdown voltage. Ebv and Dbd
signify the component behavior in the breakdown region,
and the capacitance in Dbd assumes
a zero value. Figure 10 represents a unidirectional device.
When the discharge is not applied, the same component circuit can be
simplified to predict the load effect on the desired transmitted signal.
In particular, Rp can be ignored, and Cp assumes the zero
bias value, which can differ from the one at the clamping voltage, especially
for the diode.
The capacitance Cp can be measured at a low frequency (at which
the series inductance effect can be ignored) by connecting the device
directly to a resistance-inductance-capacitance (RLC) meter. The total
series inductance value can be recovered by measuring the transmitting
characteristics of the device-loaded line (see Figure 11). The procedure
is described in the next section.
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| Figure 11. Simplified circuit for low-level signals. |
Measurement Setup
For the ESD experiment, the discharge could not be performed directly
on the PCB trace because the gun-radiated field would have coupled to
the traces, which could not be modeled. The model considers an impulsive
transverse electromagnetic mode (TEM) wave reaching the victim trace
where the suppressor is mounted. Although this condition can be realized
by connecting a coaxial cable to the PCB and performing the discharge
at the beginning of the cable, it must be done inside a shielded room
to avoid propagation of the gun-radiated field (see Figure 12). The
PCB traces are then connected to a 1-GHz oscilloscope (Tektronix SCD
1000) to capture the structure's response to the ESD. The corresponding
response time of the oscilloscope is 0.35 nanoseconds, sufficiently
lower than the rise times to be measured.
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| Figure 12. Measurement setup. |
Figure 13 shows the generator (Schaffner NSG 432) injecting the discharge
at the beginning of the coaxial cable (RG 214) inside the shielded room.
Figure 14 is a photograph of the analyzed PCB. A contact discharge is
performed to ensure high repeatability in the produced waveform.
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| Figure 13. The ESD generator placed inside the shielded room. |
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| Figure 14. The PCB circuit ready for analysis. |
Two different instruments were used to measure the parasitic elements
in a zero-bias operating condition. The capacitance Cp was measured
by connecting the suppressor at the input of an RLC meter (Hewlett-Packard
HP 4285A), using a low frequency (1 MHz) to avoid a series inductance
effect. Further, a network analyzer (Hewlett-Packard HP 8753D) was used
to measure the transmission coefficient of the line with the suppressor
mounted. The component exhibits a series resonance (see Figure 11).
Because the suppressor is mounted parallel to the line, a zero transmission
occurs when the component resonates. Therefore, the inductance value
can be recovered from the resonant frequency and the previously measured
Cp. Simulating a clock signal, the network analyzer's time domain
facility was used to determine the response of the loaded line to a
step excitation.
Two commercial suppressor devices were considered for both the simulation
and the actual measurements: a 275-V varistor and a 300-V diode. The
varistor (Siemens-Matsushita S14K275) exhibited a clamping voltage of
275 V and a declared response time of 25 nanoseconds. The distance between
terminals was 14 mm. The varistor is 1 cm in diameter. With the component
mounted, the leads were 3 mm in length. The nonlinear resistance values
were determined using the macromodel shown in Figure 9 (Lwire
= 15 nH, Rbulk = 0.3 W,
Rleak = 10 MW,
C = 500 pF). The V-I characteristics from the manufacturer's
data sheet were implemented for the nonlinear resistance.
The avalanche diode (Semitron 1.5KE300CA) exhibited a 300-V clamping
voltage, peak power of 1500 W, an intrinsic response time of 1 picosecond,
and a declared capacitance of 15 pF. The diode is a cylinder with a
diameter of 4 mm and a length of 9 mm. With the component mounted, the
leads were 3 mm in length. Referring to the macromodel in Figure 10,
Lwires = 19 nH, Rf
= 0.1 W, Rbulk
= 0.3 W, Ebv
= 300 V, capacitance in Dfw
= 590 pF, and capacitance in Dbd
= 0 pF.
Figure 15 shows the simulation results for the voltage at port 11 when
the suppressor is inserted at port 8 of the circuit in Figure 3. The
circuit in Figure 6a excites port 8, assuming an initial voltage of
6 kV for the capacitance C1 and all
other ports connected to a 50-W load. In
this way, the excitation is the voltage pulse reported in Figure 6b.
Figure 16 shows the experimental results obtained using a real ESD gun
(according to the procedure described in the previous section) for 6-kV
discharge. The darker line is related to the diode (clamping voltage
300 V) and the lighter line is related to the varistor (clamping voltage
275 V).
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| Figure 15. CAD simulation results. |
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| Figure 16. Experimental results. |
It is interesting to note that both devices work well at >5 nanoseconds
after the discharge (forcing the voltages to their clamping characteristics),
but that the first high peak passes completely through the device because
of the parasitic elements, especially the series inductance. The peak
occurring at about 17 nanoseconds is due to a double reflection of the
ESD pulse at the two cable ends. At one end the reflection produced
by the suppressor acts as a short circuit, and at the other end the
reflection of the gun acts as an open circuit (R1
= 330 W).
Small Signal Response. Figure
17 shows the transmission coefficients of the 50-W
line loaded by the varistor and by the diode. It is evident that the
devices greatly affect the signal transmission above 20 MHz. Table I
reports the inductance values calculated using the resonance frequency
and the capacitance measured with the RLC meter at 1 MHz.
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Protection Device
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Resonant Frequency
(MHz)
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Measured Capitance
(pF)
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Computed Inductance
(nH)
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| Varistor, 275 V |
72.18
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332.5
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14.6
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Diode, 300 V
|
104.2
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123.5
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18.9
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Table I. Measured values of parasitic parameters
for two commercial suppressor devices.
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It is critical to note that the inductance values are comparable for
the two devices, whereas the capacitance values are significantly different.
The series inductance, which depends mainly on the mounting techniques
and device dimensions (similar in this case), can be reduced through
the use of surface-mount devices. Moreover, the junction capacitance
in the diode strongly depends on the chosen clamping voltage; for example,
a diode of the same family as the one considered in this article, but
with a clamping voltage of 6.8 V, exhibits a zero-bias capacitance of
4750 pF.
Step Excitation. Figure 18 illustrates the network analyzer's
time domain with a frequency span of 1 GHz and a rise time of about
1.5 nanoseconds. The response of the two devices to this excitation
is shown in Figure 19. When loading the line, the rise time is greatly
increased, which could produce a malfunction in an actual circuit. The
varistor produces a greater degradation of the input signal in accordance
with its lower resonant frequency.
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| Figure 18. The time step produced by the network analyzer. |
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Figure 19. Step response of the varistor (a) and the diode
(b) to the excitation graphed in Figure 18.
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Conclusion
Using transient voltage suppressors on circuit ports can protect high-speed
data lines from damage caused by ESD. The effects of different suppressors
on ESD excitation was analyzed by an ad hoc commercial code developed
in collaboration with High Design Technology (Turin, Italy). Circuits
were analyzed with both a varistor and an avalanche diode using a macromodel
in a commercial CAD program. The theoretical results agreed with the
experimental ones.
1. High Design Technology, Post-layout Rapid Exhaustive Simulation
and Test of Operation (PRESTO) 3.0 User's Manual, (Turin,
Italy: 1997).
2. S Papatheodorou, R Harrington, and JR Mautz, "The Equivalent
Circuit of a Microstrip Crossover in a Dielectric Substrate," IEEE
Transactions on Microwave Theory and Technique 38, no. 2 (1980):
135140.
3. "Electromagnetic Compatibility (EMC) Part 4: Testing and Measurement
Techniques, Section 2: Electrostatic Discharge Immunity Test," EN 61000-4-2,
(Geneva: International Electrotechnical Commission, 1995).
4. G Cerri, R De Leo, and V Mariani Primiani, "ESD Response in
Multilayer Printed Circuit Boards," Compliance Engineering (European
Edition) XV, no. 2 (1998): 6468.
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